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Laser Drilling Technology: Pushing the Limits of PCB Microvia Processing

szshuoqiang
2025-05-10
Hitachi\'s latest laser drilling technology reduces hole diameter to 10μm, 5 times more precise than traditional mechanical drilling4. Femtosecond laser enables contactless processing, avoiding mechanical stress damage. In 5G base stations, 16-layer HDI boards with laser blind/buried vias improve signal transmission efficiency by 50% while saving 30% board space4.

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